SiliconeVerified data
Anseal Technology · SI-850Thermally Conductive Silicone Sealant
Elastic thermal sealing and potting across a wide temperature range, 1.5 W/m·K.
ThermalSealing
Application fit82%Based on 8 application conditions
Key parameters
ChemistrySilicone
Curing methodRoom temperature
Service temperature-60–200°C
Viscosity85,000 mPa·s
Lap shear strength3.2 MPa
Evidence levelB · Verified
Applications & limitations
Recommended for aluminum-to-composite structural bonding
Validated for -40°C thermal cycling
Surface treatment required for low-energy plastics
Test evidence
B
Independent application testLap shear after 500 thermal cycles
Sample batch, method and commercial disclosure available in full report.
Selection results are for initial screening only and do not replace validation under actual process conditions. Complete compatibility, reliability and compliance tests before production use.