Reactive Hot MeltVerified data
Lianchuang Polymers · HM-7820PUR Electronics Assembly Hot Melt
Stable open time and humidity resistance for narrow-bezel and electronics assembly.
Narrow bezelFast set
Application fit86%Based on 8 application conditions
Key parameters
ChemistryReactive Hot Melt
Curing methodMoisture cure
Service temperature-30–100°C
Viscosity7,800 mPa·s
Lap shear strength9 MPa
Evidence levelB · Verified
Applications & limitations
Recommended for aluminum-to-composite structural bonding
Validated for -40°C thermal cycling
Surface treatment required for low-energy plastics
Test evidence
B
Independent application testLap shear after 500 thermal cycles
Sample batch, method and commercial disclosure available in full report.
Selection results are for initial screening only and do not replace validation under actual process conditions. Complete compatibility, reliability and compliance tests before production use.